Program Schedule
Upadted Program (PDF file) (Updated on March 18)
Day 1 - Mon, March 22
09:00-09:20 | Opening Speech | ||
Tadatomo Suga University of Tokyo |
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09:20-10:00 | Keynote Speech : Development and Policy on the Eco-electronics in China |
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Yongfeng Nie Tsinghua University, China |
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10:00-10:40 | Keynote Speech : An Industry Vision How to Move EcoDesign (Design for Environment) Forward in China |
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Prof.Dr.Ir.Ab Stevels Chair for Applied EcoDesign,Design for Sustainability Lab, Delft University of Technology and Environmental Competence Centre, Philips Consumer Electronics. |
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10:40-11:20 | Keynote Speech: Plastic Thin-Film Transistors-Gateway to Structurally Inspiring Green Electronics |
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Beng S. Ong*, Yiliang Wu, Ping Liu, Sandra Gardner Materials Design and Integration laboratory, Xerox Research Centre of Canada |
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11:20-12:30 | Lunch | ||
Design for Environment in Electronics Industry | Lead free Technologies (1) | ||
12:30-12:55 | Green Electronics Trends - Meeting the Requirements of the European Market | 12:30-12:55 | (Invited Speech) Development and Trend of Lead-free Solders |
Karsten Schischke1, Hansjoerg Griese2, Herbert Reichl1, Berlin Center of Advanced Packaging (BeCAP), c/o Technical University of Berlin, Germany | Jusheng Ma, Xiaoyan Li, Guohai Chen, Zhiting Geng, Guanglong Wang, Dept. of Materials Science & Engineering, Tsinghua University, China | ||
12:55-13:20 | Fujitsu's approach to ecological materials technolgy for sustainable society - Recycling technology for notebook PC - |
12:55-13:20 | Production of Ultra Fine Uniform Lead-Free Solder Powders by A New Atomization Technology |
Nobuo Kamehara, Yuzo Horikoshi, Isao Watanabe, Koichi Kimura, Takahumi Hashitani and Kouta Nishii. Fujitsu laboratories, Japan | Kazumi Minagawa, Hideki Kakisawa, Susumu Takamomi, Yoshiaki Osawa and Kohmei Halada, National Institute for Materials Science, Japan | ||
13:20-13:45 | Design for Environment in Motorola | 13:20-13:45 | Wettability Characteristics of Sn-3.5Ag Solder on Copper Treated By ND:YAG Laser |
William Olson, William F. Hoffman III, Motorola Physical Realization Research Center - Europe, Motorola Schaumburg, USA | Zhenqing Zhao, Chunqing Wang, Mingyu Li, Lingchao Kong, State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology | ||
13:45-14:10 | Seiko Epson's System for Creating Environmentally Conscious Products | 13:45-14:10 | Some Characterization of Lead-free Sn-Cu Solder Electroplating |
Masanori Yagasaki, Eiko Mimura, Kosuke Masuzawa, Yoichi Ushiyama, Kiyomi Nakano, *1 Kazuhiro Nishida, Takeshi Takizawa*2 Seiko Epson, Japan | Guohai Chen, Sowjun Matsumura*, Jusheng Ma, Dept. of Materials Science & Engineering, Tsinghua University, China,* Okuno Chemical Industries, Japan | ||
14:10-14:20 | Break | ||
14:20-14:45 | Outsourcing and EcoDesign ? The Challenge Ahead | 14:20-14:45 | Effect of Stress Relaxation on Low Cycle Fatigue Life of Pb-free Solder Joints |
Nils de Caluwe, Philips Consumer Electronics, Singapore | Yoshiharu KARIYA1, Takuya HOSOI2 and Tadatomo SUGA3, 1National institute for Materials Science, 2 Graduate School of Shibaura Institute of Technology, Research Center for Advanced Science & Technology, 3 The University of Tokyo, Japan | ||
14:45-15:10 | Comparative Analysis of the Manufacturing and Consumer Use Phases of Two Generations of Semiconductors | 14:45-15:10 | A Novel Reflow Method for Electronic Area Array Packaging |
Marissa A. Yao1, Allen R. Wilson1, Terrence J. McManus1, Farhang Shadman2, 1 Intel Corporation, 2 University of Arizona | Rong An, Mingyu Li, Chunqing Wang, Lingchao Kong SKL AWPT,Harbin Institute of Technology, China | ||
15:10-15:35 | Effective Bi-directional Communication Technique of Environmental Information. -The present state of environmental communication in Japan | 15:10-15:35 | The Application of FEA in Mechanical Bending Fatigue Test of BGA Assemblies |
Yoko Mayuzumi*1, Hyojeong Jin*1, Ikuro Choh*2, Global Information and Telecommunication Studies Waseda University, Japan | Yahong Wang, Jim Liu,MATC-Asia, Motorola (China) Electronics Ltd | ||
15:35-16:00 | Coffee Break | ||
DfE Tool and Evaluation | Lead free Technologies (2) | ||
16:00-16:25 | Some Simple LCA Methods for Estimating Environmental Burden During the Early Stages of Product Eco-Design | 16:00-16:25 | TBD |
Jahau Lewis Chen, National Cheng Kung University, Taiwan | Ishikawa Metal, Japan | ||
16:25-16:50 | Studies on Application of Designing for Environment for Information Technology Products in Taiwan | 16:25-16:50 | Development of a Design Tool and its Application in Pb-free Micro-solders |
Ching-Chih Lin1, Zen Wang2, Cheng-Hung Lee1, 1. Associate Researcher of CESH, Industrial Technology Research Institute, Taiwan, 2. Manager of CESH, Industrial Technology Research Institute, Taiwan | X.J.Liu1, I.Ohnuma1, S.L.Chen2, R.Kainuma1, K.Ishida1 and Y.A.Chang2, 1- Tohoku University, Japan, 2-University of Wisconsin, USA | ||
16:50-17:15 | The Role of TRIZ Method in Eco-Innovation of Green Electronics | 16:50-17:15 | Research on the Sn-Zn Lead free Solder |
Jahau Lewis Chen, National Cheng Kung University, Taiwan | Xiaoyan Li, Guohai Chen, Jusheng Ma, Tsinghua University, China | ||
17:15-17:40 | Environmental Parameters of TRIZ Contradiction Matrix for Ecodesign | 17:15-17:40 | |
Norie Kobayashi, Atsushi Aoyama, Tokyo Institute of Technology, Japan | |||
18:00-20:00 | Banquet |
Day 2 - Tue, March 23
Green Supply Chain and Chemical Management | Special Session: Inverse Manufacturing | ||
09:00-09:25 | 09:00-09:25 | The Results and Activities in Inverse Manufacturing Forum | |
Shinji Takahashi, Takahisa Mano, Manufacturing Science and Technology Center, Japan | |||
09:25-09:50 | Environmentally-Sensitive Materials in Electronic Products & RoHS | 09:25-09:50 | Feasibility Study on PC Global Recycling |
Mark Newton, Frank Shou, Worldwide Environmental Affairs, China | Kazuhiko Nakamura 1, Takeshi Koga 2, Tadatomo Suga 1, 1 University of Tokyo, 2 Fujitsu, Japan | ||
09:50-10:15 | Sony's Green Procurement Policy | 09:50-10:15 | Alternative Evaluation Method; Eco-efficiency Potencial Assessment |
Masakazu Okano, Sony, Japan | Masahito Aizawa1, Ken Asaoka1, *Yasuo Kitano1, Takashi Shimizutani1, Shinji Takahashi2, Takahisa Mano2, 1 Environmental Management for Sustainability, 2Manufacturing Science and Technology Center | ||
10:15-10:40 | Greening Supply Chain - GP Programs of the Asian Productivity Organization - | ||
Takuki Murayama, Asian Productivity Organization, Japan | |||
10:40-11:05 | Testing Method for RoHS Substances - Experience at Motorola | 10:30-17:00 | Lead-free Tutorial Course Lead-free Tutorial CourseTutors Thilo Sack, Celestica Vivek Gupta, Intel Bance Hom, Consultech International Ruben Bergman, HDP User Group |
Markus Stutz, Michael Riess, Motorola Physical Realization Research Center-Europe, Motorola GmbH, Taunusstein, Germany | |||
11:05-11:30 | Electronic Products and Materials Assay | ||
Song Wei, Jim Liu, Liang Xia, Qian Chunyan, Yang Yanli, Di Zhiguang, Beijing Center for Physical and Chemical Analysis, Beijing Pony Center for Physical and Chemical Analysis, Motorola, China | |||
11:30-11:55 | |||
11:55-13:00 | Lunch & Poster Session 1 Research Progress on the Utilization of old Household Appliances Youliang Zhang, CHEARI, China |
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Recycling | |||
13:00-13:25 | (Invited Speech) Legal Framework for Recycling Oriented Society and Environmental Activities of Electric Home Appliances Industry in Japan |
Lead-free Tutorial Course | |
Yasuaki Seyama, Association for Electric Home Appliances, Japan | |||
13:25-13:50 | The Development of Green Electronics in Wuxi | ||
Xio Song Zhang, Wuxi High Tech. Zone, China | |||
13:50-14:15 | Study and Development of Appliances Recycling Management Information System | ||
Liu zhifeng Lv yi Zhou hougui, Hefei University of Technology, China | |||
14:15-14:40 | Theoretical Considerations on Self Sustainable Recycling Systems | ||
Hidetaka Hayashi, Research Center for Advanced Science and Technology, University of Tokyo, Japan | |||
14:40-14:55 | Break | ||
14:55-15:20 | Strategy for Green Electronic & Electrical Industry | ||
Zhou Zhongfan, China Research Academy of Environmental Science, China | |||
15:20-15:45 | Electronic Waste Problem in China: Guiyu and Taizhou | ||
Mei-Ping Chan, Greenpeace China | |||
15:45-16:10 | Research on High Efficiency E-waste Recycling System | ||
Pan junqi Liu zhifeng Liu guangfu Qi yunhui, Hefei University of Technology, China | |||
16:10-16:35 | Discussion on the Recycle of Used PC in Shenzhen | ||
Hao Cheng, Yujin Cheng, Pinzhang Liu, Solid E-waste Management Center, China | |||
16:35-17:00 | Policy Research on the Pollution Prevention in E-waste Recycle Industry | ||
Zhiming Deng, Guandong Environmental Protection Bureau, China | |||
17:00-17:10 | Closing Speech | ||
TBA, China Society of Environmental Science |
Lead-free Tutorial Course |
Tutors: Thilo Sack, Celestica Vivek Gupta, Intel Bance Hom, Consultech International Inc Ruben Bergman, HDP User Group HDP (High Density Packaging) User Group International, Inc. is a non-profit trade organization incorporated in the State of Arizona, USA that offers memberships to companies involved in the supply chain of producing products that utilize high-density electronic packages. The knowledge base generated by this organization and its members over the last five years with lead and lead-free solder alloys makes this focus a natural value added area for the members of HDP User Group. "Lead-free tutorial" at EcoDesign China Symposium provides a comprehensive practical course. The tutorial basically covers the "General Purpose Lead-free Assembly System Implementation Guideline" issued by HDP User Group. HDP User Group has received the Soldertec Global Lead-Free Solder Consortium Award year 2003. Who Should Attend - System integrators will implement lead-free processes in products - Packaging engineers and material suppliers will develop semiconductors and materials which comply with lead-free processes Draft agenda Opening - Ruben Bergman Pb-free drivers - Vivek Gupta
The GPLF Material System - Vivek Gupta/Bance Hom
Board Design - Vivek Gupta
Cost Issues - Vivek Gupta |