Program Schedule


Upadted Program (PDF file) (Updated on March 18)

Day 1 - Mon, March 22

09:00-09:20 Opening Speech
Tadatomo Suga
University of Tokyo
09:20-10:00 Keynote Speech :
Development and Policy on the Eco-electronics in China
Yongfeng Nie
Tsinghua University, China
10:00-10:40 Keynote Speech :
An Industry Vision How to Move EcoDesign (Design for Environment) Forward in China
Prof.Dr.Ir.Ab Stevels
Chair for Applied EcoDesign,Design for Sustainability Lab, Delft University of Technology and Environmental Competence Centre, Philips Consumer Electronics.
10:40-11:20 Keynote Speech:
Plastic Thin-Film Transistors-Gateway to Structurally Inspiring Green Electronics
Beng S. Ong*, Yiliang Wu, Ping Liu, Sandra Gardner
Materials Design and Integration laboratory, Xerox Research Centre of Canada
11:20-12:30 Lunch
Design for Environment in Electronics Industry Lead free Technologies (1)
12:30-12:55 Green Electronics Trends - Meeting the Requirements of the European Market 12:30-12:55 (Invited Speech)
Development and Trend of Lead-free Solders
Karsten Schischke1, Hansjoerg Griese2, Herbert Reichl1, Berlin Center of Advanced Packaging (BeCAP), c/o Technical University of Berlin, Germany Jusheng Ma, Xiaoyan Li, Guohai Chen, Zhiting Geng, Guanglong Wang, Dept. of Materials Science & Engineering, Tsinghua University, China
12:55-13:20 Fujitsu's approach to ecological materials technolgy for sustainable society
- Recycling technology for notebook PC -
12:55-13:20 Production of Ultra Fine Uniform Lead-Free Solder Powders by A New Atomization Technology
Nobuo Kamehara, Yuzo Horikoshi, Isao Watanabe, Koichi Kimura, Takahumi Hashitani and Kouta Nishii. Fujitsu laboratories, Japan Kazumi Minagawa, Hideki Kakisawa, Susumu Takamomi, Yoshiaki Osawa and Kohmei Halada, National Institute for Materials Science, Japan
13:20-13:45 Design for Environment in Motorola 13:20-13:45 Wettability Characteristics of Sn-3.5Ag Solder on Copper Treated By ND:YAG Laser
William Olson, William F. Hoffman III, Motorola Physical Realization Research Center - Europe, Motorola Schaumburg, USA Zhenqing Zhao, Chunqing Wang, Mingyu Li, Lingchao Kong, State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology
13:45-14:10 Seiko Epson's System for Creating Environmentally Conscious Products 13:45-14:10 Some Characterization of Lead-free Sn-Cu Solder Electroplating
Masanori Yagasaki, Eiko Mimura, Kosuke Masuzawa, Yoichi Ushiyama, Kiyomi Nakano, *1 Kazuhiro Nishida, Takeshi Takizawa*2 Seiko Epson, Japan Guohai Chen, Sowjun Matsumura*, Jusheng Ma, Dept. of Materials Science & Engineering, Tsinghua University, China,* Okuno Chemical Industries, Japan
14:10-14:20 Break
14:20-14:45 Outsourcing and EcoDesign ? The Challenge Ahead 14:20-14:45 Effect of Stress Relaxation on Low Cycle Fatigue Life of Pb-free Solder Joints
Nils de Caluwe, Philips Consumer Electronics, Singapore Yoshiharu KARIYA1, Takuya HOSOI2 and Tadatomo SUGA3, 1National institute for Materials Science, 2 Graduate School of Shibaura Institute of Technology, Research Center for Advanced Science & Technology, 3 The University of Tokyo, Japan
14:45-15:10 Comparative Analysis of the Manufacturing and Consumer Use Phases of Two Generations of Semiconductors 14:45-15:10 A Novel Reflow Method for Electronic Area Array Packaging
Marissa A. Yao1, Allen R. Wilson1, Terrence J. McManus1, Farhang Shadman2, 1 Intel Corporation, 2 University of Arizona Rong An, Mingyu Li, Chunqing Wang, Lingchao Kong SKL AWPT,Harbin Institute of Technology, China
15:10-15:35 Effective Bi-directional Communication Technique of Environmental Information. -The present state of environmental communication in Japan 15:10-15:35 The Application of FEA in Mechanical Bending Fatigue Test of BGA Assemblies
Yoko Mayuzumi*1, Hyojeong Jin*1, Ikuro Choh*2, Global Information and Telecommunication Studies Waseda University, Japan Yahong Wang, Jim Liu,MATC-Asia, Motorola (China) Electronics Ltd
15:35-16:00 Coffee Break
DfE Tool and Evaluation Lead free Technologies (2)
16:00-16:25 Some Simple LCA Methods for Estimating Environmental Burden During the Early Stages of Product Eco-Design 16:00-16:25 TBD
Jahau Lewis Chen, National Cheng Kung University, Taiwan Ishikawa Metal, Japan
16:25-16:50 Studies on Application of Designing for Environment for Information Technology Products in Taiwan 16:25-16:50 Development of a Design Tool and its Application in Pb-free Micro-solders
Ching-Chih Lin1, Zen Wang2, Cheng-Hung Lee1, 1. Associate Researcher of CESH, Industrial Technology Research Institute, Taiwan, 2. Manager of CESH, Industrial Technology Research Institute, Taiwan X.J.Liu1, I.Ohnuma1, S.L.Chen2, R.Kainuma1, K.Ishida1 and Y.A.Chang2, 1- Tohoku University, Japan, 2-University of Wisconsin, USA
16:50-17:15 The Role of TRIZ Method in Eco-Innovation of Green Electronics 16:50-17:15 Research on the Sn-Zn Lead free Solder
Jahau Lewis Chen, National Cheng Kung University, Taiwan Xiaoyan Li, Guohai Chen, Jusheng Ma, Tsinghua University, China
17:15-17:40 Environmental Parameters of TRIZ Contradiction Matrix for Ecodesign 17:15-17:40
Norie Kobayashi, Atsushi Aoyama, Tokyo Institute of Technology, Japan
18:00-20:00 Banquet

Day 2 - Tue, March 23

Green Supply Chain and Chemical Management Special Session: Inverse Manufacturing
09:00-09:25 09:00-09:25 The Results and Activities in Inverse Manufacturing Forum
Shinji Takahashi, Takahisa Mano, Manufacturing Science and Technology Center, Japan
09:25-09:50 Environmentally-Sensitive Materials in Electronic Products & RoHS 09:25-09:50 Feasibility Study on PC Global Recycling
Mark Newton, Frank Shou, Worldwide Environmental Affairs, China Kazuhiko Nakamura 1, Takeshi Koga 2, Tadatomo Suga 1, 1 University of Tokyo, 2 Fujitsu, Japan
09:50-10:15 Sony's Green Procurement Policy 09:50-10:15 Alternative Evaluation Method; Eco-efficiency Potencial Assessment
Masakazu Okano, Sony, Japan Masahito Aizawa1, Ken Asaoka1, *Yasuo Kitano1, Takashi Shimizutani1, Shinji Takahashi2, Takahisa Mano2, 1 Environmental Management for Sustainability, 2Manufacturing Science and Technology Center
10:15-10:40 Greening Supply Chain - GP Programs of the Asian Productivity Organization -
Takuki Murayama, Asian Productivity Organization, Japan
10:40-11:05 Testing Method for RoHS Substances - Experience at Motorola 10:30-17:00 Lead-free Tutorial Course

Lead-free Tutorial CourseTutors
Thilo Sack, Celestica
Vivek Gupta, Intel
Bance Hom, Consultech International
Ruben Bergman, HDP User Group
Markus Stutz, Michael Riess, Motorola Physical Realization Research Center-Europe, Motorola GmbH, Taunusstein, Germany
11:05-11:30 Electronic Products and Materials Assay
Song Wei, Jim Liu, Liang Xia, Qian Chunyan, Yang Yanli, Di Zhiguang, Beijing Center for Physical and Chemical Analysis, Beijing Pony Center for Physical and Chemical Analysis, Motorola, China
11:30-11:55
11:55-13:00 Lunch & Poster Session

1 Research Progress on the Utilization of old Household Appliances
Youliang Zhang, CHEARI, China
Recycling
13:00-13:25 (Invited Speech)
Legal Framework for Recycling Oriented Society and Environmental Activities of Electric Home Appliances Industry in Japan
Lead-free Tutorial Course
Yasuaki Seyama, Association for Electric Home Appliances, Japan
13:25-13:50 The Development of Green Electronics in Wuxi
Xio Song Zhang, Wuxi High Tech. Zone, China
13:50-14:15 Study and Development of Appliances Recycling Management Information System
Liu zhifeng Lv yi Zhou hougui, Hefei University of Technology, China
14:15-14:40 Theoretical Considerations on Self Sustainable Recycling Systems
Hidetaka Hayashi, Research Center for Advanced Science and Technology, University of Tokyo, Japan
14:40-14:55 Break
14:55-15:20 Strategy for Green Electronic & Electrical Industry
Zhou Zhongfan, China Research Academy of Environmental Science, China
15:20-15:45 Electronic Waste Problem in China: Guiyu and Taizhou
Mei-Ping Chan, Greenpeace China
15:45-16:10 Research on High Efficiency E-waste Recycling System
Pan junqi Liu zhifeng Liu guangfu Qi yunhui, Hefei University of Technology, China
16:10-16:35 Discussion on the Recycle of Used PC in Shenzhen
Hao Cheng, Yujin Cheng, Pinzhang Liu, Solid E-waste Management Center, China
16:35-17:00 Policy Research on the Pollution Prevention in E-waste Recycle Industry
Zhiming Deng, Guandong Environmental Protection Bureau, China
17:00-17:10 Closing Speech
TBA, China Society of Environmental Science

Lead-free Tutorial Course

Tutors:
Thilo Sack, Celestica
Vivek Gupta, Intel
Bance Hom, Consultech International Inc
Ruben Bergman, HDP User Group


HDP (High Density Packaging) User Group International, Inc. is a non-profit trade organization incorporated in the State of Arizona, USA that offers memberships to companies involved in the supply chain of producing products that utilize high-density electronic packages. The knowledge base generated by this organization and its members over the last five years with lead and lead-free solder alloys makes this focus a natural value added area for the members of HDP User Group. "Lead-free tutorial" at EcoDesign China Symposium provides a comprehensive practical course. The tutorial basically covers the "General Purpose Lead-free Assembly System Implementation Guideline" issued by HDP User Group. HDP User Group has received the Soldertec Global Lead-Free Solder Consortium Award year 2003.

Who Should Attend
- System integrators will implement lead-free processes in products
- Packaging engineers and material suppliers will develop semiconductors and materials which comply with lead-free processes

Draft agenda

Opening - Ruben Bergman

Pb-free drivers - Vivek Gupta
  • Legislative Requirements
  • Market Driven Requirements
  • Definition of Lead-free Electronic Products
  • Typical lead-free transition roadmap

The GPLF Material System - Vivek Gupta/Bance Hom

  • System Overview
  • Solder Alloys
  • Component Surface Finishes
  • Board Surface Finishes
  • Board Materials

Board Design - Vivek Gupta

GPLF Assembly Process Requirements - Thilo Sack

  • Overview Assembly Processes
  • Component MSL Specifications
  • Compatibility System
  • Lead-free Manufacturing Processes
    - Reflow Soldering Process
    - Wave Soldering Process
    - Vapor Phase Soldering Process
    - Rework Process
  • Other Manufacturing Issues
    - Inspection
    - Marking

Cost Issues - Vivek Gupta

Data Sheet Requirements - Thilo Sack

Legislation and Industry Specification Documents - Ruben Bergman

Questions and Answers